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November 2012
TOP STORY
Architectural Changes Ahead
For the past couple of process nodes chipmakers have been developing power-saving features that have been largely ignored by OEMs. That’s beginning to change. (more)
Nexcom
VTC 7110-C4
Intel® Core™ i7 Fanless In-Vehicle Surveillance Computer
Main Features •  Built-in Intel® Core™ i7-2610UE 1.5G Hz processor •  4-channel PoE/ dual removal 2.5" SSD tray/ CFast storage •  Optional CAN bus supporting SAE J1939/ J1708 •  2 SIM card slots •  9~36V wide range DC power input •  Smarter ignition power on/off, delay-time/ low voltage protection •  Certified by CE/FCC/e13 Mark
FEATURED NEWS & ANALYSIS
NEXCOM Expands NDiS Family with New Flagship Digital Signage Player M532
X-ES Introduces Intel® Core™ i7 Processor-Based Small Form Factor System
150W Industrial ATX Power Supply for PC/104, EPIC, and EBX Single Board Computers
Emerson Network Power Launches First Fanless Embedded Computer Featuring Second Generation Intel Processor
Kontron Receives PTCRB Certification on its M2M Smart Services Developer Kit
Axiomtek's Fanless Atom Cedarview 3.5-inch Embedded Board Supports -20°C to +70°C - CAPA830
Portwell Announces New 2u Rackmount Network Server Based On The Intel® Platform For Communications Infrastructure
Logic Supply Extends Its Fanless Rugged Computer Line; AU145 Dramatically Improves Performance to Size Ratio
FEATURED WHITE PAPERS & VIDEOS
The 3rd Generation Intel® Core™ Processor: A must have for all high-performance embedded computing appliances
Visual Processing in Rugged Environments
X-ES Adds 6U VPX Module to Its Line of Intel® Core™ i7 Processor-Based Products
AAEON Announces High Performance Graphics-Rich 3.5" SubCompact Board with 3rd Generation Intel® Core™ i-Series Processors; GENE-QM77
PGI to Deliver OpenACC for Intel Xeon Phi
AAEON Releases New COM-QM77 Rev.B COM Express Type 6 module with 3rd Generation Intel® Core™ iSeries Processors
Lanner’s Cost-Effective, Fanless In-Vehicle Computers with Intel® Atom™ Processor
Intel Delivers New Architecture for Discovery with Intel® Xeon Phi™ Coprocessors
X-ES
XPedite7450: Intel Core i7 Processor-Based COM Express Module
X-ES's XPedite7450 is an enhanced, Type 6 COM Express module based on the 2nd/3rd generation Intel Core i7 processors and Intel QM67 chipset. The XPedite7450 supports up to 16 GB of DDR3 ECC SDRAM, DisplayPort graphics, x8 PCIe, x4 PCIe, x1 PCIe, SATA/eSATA, USB, HD audio, LPC bus, SMB, I²C, and RS-232 serial.
WinSystems
Fanless, Compact 1.66GHz Intel® Atom™ SBC Integrates PCI Express and PC/104
WinSystems PXM-C388 provides designers direct I/O expansion for the thousands of PC/104 modules currently available worldwide. It offers the enhanced performance and throughput of stackable PCI Express™ (PCIe) and USB. Its high-performance enables applications for security, industrial control, data acquisition, and machine-to-machine communications in the small, rugged form factor.
ARTICLES AND TECH BRIEFS
Architectural Changes Ahead For the past couple of process nodes chipmakers have been developing power-saving features that have been largely ignored by OEMs. That’s beginning to change. The need to do more and faster (more)
AdvancedTCA Vendors Look for Growth Suppliers see shift to 40G Ethernet and low power systems (more)
Many Cores but Little Parallelism Has the much-touted move to many-core systems resulted in an increase of parallel code creation? This question was recently posed by Andrew Binstock, editor-in-chief at Dr. Dobbs: "Will Parallel Code (more)
New Interfaces, Faster Chips, More Mobility Intel hints at more fundamental changes at this year's IDF, but the incremental changes are both difficult and hard to discern. Changing the interface for a computer is no simple task. It can require (more)
Intel Gets Smart with Smartphones Intel's used to-be-secret Atom SoC success in handhelds The 15 year anniversary of Intel's Developers Forum kicked off with a somewhat predictable keynote by Dadi Perlmutter, EVP/GM Intel Architecture (more)
Semiconductor Equipment Book-to-Bill Nearly Flat; Intel is Up but Flattening Two bellweather numbers – the semiconductor equipment book-to-bill and Intel's revenue – are trending towards a slim slope growth curve. The former signals that the worldwide semiconductor industry (more)
Optimize the Cost-Performance of LTE Networking Equipment To achieve the necessary wire-speed performance for large numbers of virtual networks, the underlying software architecture must provide optimized support for key technologies such as virtualization, SDN (more)
conga-TS77 Highest Performance COM Express® Type 6 3rd Generation Intel® Core™ processor-based platform Better transcode HD-HD, HD Video Conferencing Improved Graphics Performance, (more)
IDF 2012 Shifts Focus to Cloud and Mobility A wide range of processor types from datacenter to smartphones should enable the accelerated growth of software applications for Intel-based devices. (more)
Intel Expands Semiconductor IP in Handset Bid The processor giant seems serious about the handset market as shown by its BIOS collaboration with Phoenix and acquisition of Interdigital 3G patents. (more)
Optimize the Cost-Performance of LTE Networking Equipment To achieve the necessary wire-speed performance for large numbers of virtual networks, the underlying software architecture must provide optimized support for key technologies such as virtualization, SDN and DPI. (more)
Swissbit Readies Next Growth Phase Firm expands DRAM module and storage lines. (more)
Security in Intelligent Systems As the "attack space" increases with the number of connected intelligent systems, so does the need to design in security precautions from the early stages of design. (more)
M2M Communications with Wi-Fi in the 5 GHz Band Networks based on 2.4 GHz ISM band standards suffer from the effects of network congestion – data drop-outs, latencies, disconnections and the lesser-known but increasingly important problem of battery (more)
Linux or Android for Automotive Infotainment Systems? Linux is probably in a better position to achieve widespread adoption, while Android will continue to make things interesting in the "connected car" segment. Today's new car buyers are including (more)
"Grimm" Creatures Transform Oregon Effects Studio Portland-based HiveFX must balance technical expertise with graphic artistry to create stunning digital visual effects for NBC's hit TV show, "Grimm." (more)
EMX Form Factor Unites COM and SBC Camps By integrating COM Express modules and a new, efficient, stacking I/O connector into a standardized shape, EMX offers advantages to both vendors and customers for new small form factor designs. (more)
Making it Easier to Make the Right Decisions Every designer in the process of bringing a product or solution to market is constantly faced with tradeoffs. Deploy quickly or augment the features? Lower the cost or enhance the functionality? These (more)
High-Performance Graphics Drive Infotainment Design Small form factor COMs have proven to be broadly applicable to the diverse range of digital signage deployments and application needs characterized by the infotainment arena. (more)
Embedded Computers in Today's Railway Systems Compact PCI-based systems for railway applications offer all current PC functions and up-to-date technology, as well as robustness, safety and long-term availability. (more)
Improve Linux Real-time Performance in Multicore Devices with Light-Weight Threading The history of real-time embedded Linux has been to prove that Linux can operate as well as a traditional RTOS solution. Linux light-weight threading brings it closer to the goal for the most serious telecom/networking applications. (more)
USB Aims for Truly Universal USB is making leaps and bounds to make it a truly universal connector. The mentality of not only advancing current technology, but branching out and re-using IP in new areas has rightly made USB a leader in the industry. (more)
GENIVI Alliance opens (car) door even further with new Compliance 2.0 spec Linux-based and fully open, Compliance 2.0 products interoperate and provide "mandatory" system functions in automotive IVI. The Europe-based non-profit GENIVI Alliance exists to create and nurture the... (more)
Going Native with SuperSpeed Why access to native 10b data is essential to troubleshooting USB 3.0 designs. (more)
From Guts to GUI The consumerization of digital signage applications is driving opportunity from the inside out. (more)
Selection Criteria for High-Endurance Industrial Storage Solutions Until recently, high entry-level prices often discouraged the use of industrial SSDs, but thanks to ongoing price optimization they are now becoming more popular as storage media. (more)
Intel® Atom™ Energizes PC/104 Thirteen PC/104 Consortium members have combined to introduce over twenty-five Intel® Atom™ processor-based products, with more on the way. (more)
Emerson Network Power
Digital Signage Gets Smart eBook
Download Emerson Network Power's Digital Signage Gets Smart eBook and learn how the Intel® embedded technology implemented by Emerson enables OEMs to rapidly and cost effectively develop high-performance digital signage products, and to re-use and modify both hardware and software components in multiple variants of platform products.
FROM THE BLOGOSPHERE
Systems Simulation Moves from Goods and Services to Experiences This is the first of two stories about Dassault Systemes move into the world of semiconductor development. …
Remaking The Playing Field Is the Imagination-MIPS deal really just a standalone purchase, or is there much more lurking under the surface? …
"MicroFlix"…Funny name; how crazy would it be if Netflix joined the Microsoft Family? If Microsoft were to buy Netflix - and it's a big "if", since it's only a rumor - MSFT could join Apple, Amazon and Google in having a huge influence on the embedded industry. Continue reading → …
increase gaming graphics
Blog Post: The Top 5 Reasons to be Thankful for CMOS
MORE FROM THE BLOGOSPHERE
PRODUCT SHOWCASE
DFI 3rd Generation Intel® Core™ Processor-Based Embedded System Targets Industrial Automation Applications (DFI-ITOX)
ATCA-7370 Dual Intel® Xeon® Processor-Based Blade (Emerson Network Power)
CPCI7203 validated with Cisco UCM (Emerson Network Power)
KR8-820 Fanless Embedded Computer (Emerson Network Power)
Kontron quad-core 3rd generation Intel® Core™ processor-based boards (Kontron)
MSI launch MS-9893 with the latest Intel® Atom™ Processor-Based (MSI Computer)
Extreme Engineering Solutions (X-ES)
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WHITE PAPERS
The 3rd Generation Intel® Core™ Processor: A must have for all high-performance embedded computing appliances
Visual Processing in Rugged Environments
Improved Graphics Performance Changes the Cost Equation in Digital Signage
Adding Video Analytics to Analog Surveillance
more white papers
UPCOMING EVENTS
CES
Las Vegas, Nevada
Tuesday, January 8- Friday, January 11 2013
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Hyatt Santa Clara, California
May 21 - 22, 2013
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Amsterdam, Netherlands
24-26 June 2013
more events
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