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September 2012
TOP STORY
IDF 2012 Shifts Focus to Cloud and Mobility
Once again, the opening keynote at the Intel Developer’s Forum was a visually dazzling event. But something was missing. To understand what, you need to compare this year’s event with the previous one. (more)
ADLINK
ADLINK's aTCA-6250 processor blade incorporates the latest dual 8-core/16-thread Intel® Xeon® Processors to provide robust computing power for high-end carrier-grade applications. Versatile connectivity options include dual 10GbE Fabric Interfaces and GbE Base Interfaces, quad front panel GbE interfaces, dual front panel USB and COM ports, and onboard SATA DOM socket.
FEATURED NEWS & ANALYSIS
ADLINK Launches State-of-the-art cPCI Blade with Eight-Core Intel® Xeon® Processor E5-2448L
X-ES Introduces 6U CompactPCI SBC Featuring 3rd Generation Intel® Core™ i7 Proc
PC/104-size Gigabit Ethernet Module with SUMIT™ PCI Express Speeds Networking
High Performing and Energy-Efficient NEXCOM COM Express ICES 668
AAEON Announces New Feature-Rich HSB-CV1P Half-Size SBC with Intel® Atom™ D2550/N2600
Impressively fast and reliable: Swissbit X-500 Series Industrial SATA II SSD
congatec introduces the new conga-BP77 COM Express Type 2 module with 3rd generation Intel® Core™ processors
ADLINK COM Express® Type 6 Module with high-performance integrated graphics for medical, gaming and military applications
Introducing the Powerful Motorola RAZR™ i with Intel Inside® and an Edge-to-Edge Display
DFI Launches a Cost-Effective Mini-ITX that Supports Graphics-Rich and Power-Saving Features
Use 3U CompactPCI Intel Core 2 Duo based SBC to build your security system!
Kontron announces next-generation digital signage kit to help streamline development and deployment of intelligent signage systems
Avnet Embedded Extends Offering to Americas Customers with Line of Computer-on-Modules from congatec, Inc.
FEATURED WHITE PAPERS & VIDEOS
Visual Processing in Rugged Environments
Improved Graphics Performance Changes the Cost Equation in Digital Signage
Axiomtek Introduces Intel® Atom™ D2550 based OPS Digital Signage Player - OPS830
Intel Labs Tunes into a Wireless Future Where Everything that Computes is Connected
NI Unveils Industry's Fastest PXI Embedded Controller With 3rd Generation Intel® Core™ i7 Processor
Intel to Software Developers: Embrace Era of Transparent Computing
Ultra Low Power AMD G-Series Based COM Express Module with Great Graphics Performance - CEM100
ADLINK Introduces High-Density Simultaneous 8-channel 100MS/s 14-Bit PXI Express Digitizer
From IDF 2012 - Low-Power Processors to Fuel Future of Mobile Computing Innovation
Supermicro® Introduces Line of Next Generation Embedded Building Block Solutions® Optimized for Wide Variety of Embedded Applications
Radisys Delivers Industry's First 40G Solution for Intel® Data Plane Development Kit
AAEON Releases RTC-700R
Intel Lowers Third-Quarter Revenue Outlook
X-ES
XPedite7450: Intel Core i7 Processor-Based COM Express Module
X-ES's XPedite7450 is an enhanced, Type 6 COM Express module based on the 2nd/3rd generation Intel Core i7 processors and Intel QM67 chipset. The XPedite7450 supports up to 16 GB of DDR3 ECC SDRAM, DisplayPort graphics, x8 PCIe, x4 PCIe, x1 PCIe, SATA/eSATA, USB, HD audio, LPC bus, SMB, I²C, and RS-232 serial.
WinSystems
Fanless, low power SBC with Intel® ATOM™ 1.66GHz
WinSystems' EPX-C380 is an embedded EPIC PC that provides an open platform for industrial applications. Powered with a single or dual core processor, it has a wealth of onboard I/O; plus can be expanded with PC/104-Plus and miniPCIe modules. This SBC will operate from -40° to +85°C without a fan.
ARTICLES AND TECH BRIEFS
Many Cores but Little Parallelism Has the much-touted move to many-core systems resulted in an increase of parallel code creation? This question was recently posed by Andrew Binstock, editor-in-chief at Dr. Dobbs: "Will Parallel Code (more)
New Interfaces, Faster Chips, More Mobility Intel hints at more fundamental changes at this year's IDF, but the incremental changes are both difficult and hard to discern. Changing the interface for a computer is no simple task. It can require (more)
Intel Gets Smart with Smartphones Intel's used to-be-secret Atom SoC success in handhelds The 15 year anniversary of Intel's Developers Forum kicked off with a somewhat predictable keynote by Dadi Perlmutter, EVP/GM Intel Architecture (more)
Semiconductor Equipment Book-to-Bill Nearly Flat; Intel is Up but Flattening Two bellweather numbers – the semiconductor equipment book-to-bill and Intel's revenue – are trending towards a slim slope growth curve. The former signals that the worldwide semiconductor industry (more)
Optimize the Cost-Performance of LTE Networking Equipment To achieve the necessary wire-speed performance for large numbers of virtual networks, the underlying software architecture must provide optimized support for key technologies such as virtualization, SDN (more)
conga-TS77 Highest Performance COM Express® Type 6 3rd Generation Intel® Core™ processor-based platform Better transcode HD-HD, HD Video Conferencing Improved Graphics Performance, (more)
IDF 2012 Shifts Focus to Cloud and Mobility A wide range of processor types from datacenter to smartphones should enable the accelerated growth of software applications for Intel-based devices. (more)
Intel Expands Semiconductor IP in Handset Bid The processor giant seems serious about the handset market as shown by its BIOS collaboration with Phoenix and acquisition of Interdigital 3G patents. (more)
Optimize the Cost-Performance of LTE Networking Equipment To achieve the necessary wire-speed performance for large numbers of virtual networks, the underlying software architecture must provide optimized support for key technologies such as virtualization, SDN and DPI. (more)
Swissbit Readies Next Growth Phase Firm expands DRAM module and storage lines. (more)
Security in Intelligent Systems As the "attack space" increases with the number of connected intelligent systems, so does the need to design in security precautions from the early stages of design. (more)
M2M Communications with Wi-Fi in the 5 GHz Band Networks based on 2.4 GHz ISM band standards suffer from the effects of network congestion – data drop-outs, latencies, disconnections and the lesser-known but increasingly important problem of battery (more)
Life in the fast lane: Linux or Android for automotive infotainment systems? Linux is probably in a better position to achieve widespread adoption, while Android will continue to make things interesting in the "connected car" segment. (more)
"Grimm" Creatures Transform Oregon Effects Studio Portland-based HiveFX must balance technical expertise with graphic artistry to create stunning digital visual effects for NBC's hit TV show, "Grimm." (more)
EMX Form Factor Unites COM and SBC Camps By integrating COM Express modules and a new, efficient, stacking I/O connector into a standardized shape, EMX offers advantages to both vendors and customers for new small form factor designs. (more)
Making it Easier to Make the Right Decisions Every designer in the process of bringing a product or solution to market is constantly faced with tradeoffs. Deploy quickly or augment the features? Lower the cost or enhance the functionality? These (more)
High-Performance Graphics Drive Infotainment Design Small form factor COMs have proven to be broadly applicable to the diverse range of digital signage deployments and application needs characterized by the infotainment arena. (more)
Embedded Computers in Today's Railway Systems Compact PCI-based systems for railway applications offer all current PC functions and up-to-date technology, as well as robustness, safety and long-term availability. (more)
Improve Linux Real-time Performance in Multicore Devices with Light-Weight Threading The history of real-time embedded Linux has been to prove that Linux can operate as well as a traditional RTOS solution. Linux light-weight threading brings it closer to the goal for the most serious telecom/networking applications. (more)
USB Aims for Truly Universal USB is making leaps and bounds to make it a truly universal connector. The mentality of not only advancing current technology, but branching out and re-using IP in new areas has rightly made USB a leader in the industry. (more)
GENIVI Alliance opens (car) door even further with new Compliance 2.0 spec Linux-based and fully open, Compliance 2.0 products interoperate and provide "mandatory" system functions in automotive IVI. The Europe-based non-profit GENIVI Alliance exists to create and nurture the... (more)
Going Native with SuperSpeed Why access to native 10b data is essential to troubleshooting USB 3.0 designs. (more)
From Guts to GUI The consumerization of digital signage applications is driving opportunity from the inside out. (more)
Selection Criteria for High-Endurance Industrial Storage Solutions Until recently, high entry-level prices often discouraged the use of industrial SSDs, but thanks to ongoing price optimization they are now becoming more popular as storage media. (more)
Intel® Atom™ Energizes PC/104 Thirteen PC/104 Consortium members have combined to introduce over twenty-five Intel® Atom™ processor-based products, with more on the way. (more)
Standards Vie for Mobile Medical Leadership Qseven modules running Windows or Linux applications on Intel Atom processors provide a proven and accessible path to market for mobile medical devices. Embedded computer manufacturers are placing their (more)
Body Area Networking Heats Up in Medical Field Standards battle brews for wireless chips For years, chip makers have been waiting for huge growth in the medical market. So far, though, the medical semiconductor market has yet to see a major boom, (more)
Facebook Wants New and Cheaper Memories For years, Intel Corp., and to a lesser extent, the systems and memory houses, dictated the roadmaps in the processor, DRAM and other segments Traditionally, Intel rolls out a new microprocessor and an (more)
Network Evolution Challenges As Ethernet gears up to 10, 40 and 100 Gigabits per second, developers better pull on their running shoes to keep up. (more)
Internet Minute Drives Packet Acceleration Intel's latest two-chip Crystal Forest platform adds data packet acceleration to existing telecommunication application and control plane functionality. Staying true to its telecommunication workload (more)
Nexcom
NEXCOM ICES 668
• COM Express Type 6 Basic Module with Intel® QM77
• Intel® 3rd Generation Core™ i7/ i5/ i3 Processors with ECC
• Support PCIe x16, 7x PCIe x1
• Up to 3x Independent Displays
Emerson Network Power
Digital Signage Gets Smart eBook
Download Emerson Network Power's Digital Signage Gets Smart eBook and learn how the Intel® embedded technology implemented by Emerson enables OEMs to rapidly and cost effectively develop high-performance digital signage products, and to re-use and modify both hardware and software components in multiple variants of platform products.
FROM THE BLOGOSPHERE
Hot Chips, Si IPOs, Wright's Law and Desert Spaceports John and Sean talk about the Hot Chips show, the decline of Silicon IPOs, Wright vs. Moore's Law, and spaceports in the desert. …
Materials, Architectures And Gordon Moore Shrinking feature sizes is so 45nm. The future is much more interesting—and challenging. …
Intel Gets Smart with Smartphones The 15 year anniversary of Intel’s Developers Forum kicked off with a somewhat predictable keynote by Dadi Perlmutter, EVP/GM Intel Architecture Group (Figure 1). We’re so used to Intel hitting it out of the park that the astounding messages bordered … Continue reading → …
Pre-order pricing revealed for AMD FX "Piledriver" desktop processors: Eight cores for $250
RAM problem
Intel future features
The next era of Transparent Computing
Intel's new Clover Trail chip will support Android & Linux
#ALGORITHMS: "Intel Empowers Parallel Web Apps"
Green Hills Software MULTI Toolchain Certified as a Functional Safety Support Tool
MORE FROM THE BLOGOSPHERE
PRODUCT SHOWCASE
DFI 3rd Generation Intel® Core™ Processor-Based Embedded System Targets Industrial Automation Applications (DFI-ITOX)
ATCA-7370 Dual Intel® Xeon® Processor-Based Blade (Emerson Network Power)
CPCI7203 validated with Cisco UCM (Emerson Network Power)
KR8-820 Fanless Embedded Computer (Emerson Network Power)
Kontron quad-core 3rd generation Intel® Core™ processor-based boards (Kontron)
MSI launch MS-9893 with the latest Intel® Atom™ Processor-Based (MSI Computer)
Extreme Engineering Solutions (X-ES)
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WHITE PAPERS
Visual Processing in Rugged Environments
Improved Graphics Performance Changes the Cost Equation in Digital Signage
Adding Video Analytics to Analog Surveillance
more white papers
VIDEOS
Swissbit Production Overview
more videos
UPCOMING EVENTS
2012 Embedded Systems Conference - Boston
Boston, MA
September 17-20
4G World 2012
Chicago, IL
October 29-November 1
RTECC - Real-Time & Embedded Computing Conference

10/02/12 - Wright Patterson AFB/Dayton, OH
10/04/12 - Tysons Corner
11/06/12 - Seattle, WA
11/08/12 - Portland, OR
LTE North America
Dallas, TX
November 14-15, 2012
LTE World Summit
Amsterdam, Netherlands
24-26 June 2013
more events
Interested in showcasing your hardware, software or services in these issues?
Contact Clair Bright, Publisher @
cbright@extensionmedia.com
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