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TOP STORY |
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Consolidating Packet Forwarding Services with Data-Plane Development Software
By Jack Lin, Yunxia Guo, and Xiang Li, ADLINK
In recent years, there has been a market and technology trend towards the convergence of network infrastructure to a common platform or modular components that support multiple network elements and functions, such as application processing, control processing, packet processing and signal processing.
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 congatec |
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congatec's latest Type 6 COM Express module, the conga-TS77, supports the 3rd generation Intel® Core™ processors. High end processing meets superior graphics performance in a scalable solution for OEMs seeking quicker time to market and faster returns on investment. Reduce developement time and secure your future with the conga-TS77.
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FEATURED NEWS & ANALYSIS |
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| Nexcom |
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NEXCOM PEAK 886VL2
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Main Features
• Scalable platform Intel® 3rd generation Core™ i7/ i5/ i3 processor, Ivy Bridge + Non-ECC
• Intel® Q77 PCH chipset support PICMG 1.3 specification
• Support Dual channel DDR3 with NON-ECC DIMMs 1333/1600MHz up to 16GB
• Support PCIex16, 4PCIe x1, 4USB3.0/ 4USB2.0, 4SATA3.0/ 2SATA2.0 and GbE
• Display support for VGA, DVI, HDMI, DosplayPort
• Dimension 338.58 x 126,39 mm2 (W x L) (8 Layers Single side)
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| X-ES |
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XPedite7450: Intel Core i7 Processor-Based COM Express Module
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X-ES's XPedite7450 is an enhanced, Type 6 COM Express module based on the 2nd/3rd generation Intel Core i7 processors and Intel QM67 chipset. The XPedite7450 supports up to 16 GB of DDR3 ECC SDRAM, DisplayPort graphics, x8 PCIe, x4 PCIe, x1 PCIe, SATA/eSATA, USB, HD audio, LPC bus, SMB, I²C, and RS-232 serial.
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ARTICLES AND TECH BRIEFS |
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EMX Form Factor Unites COM and SBC Camps
By integrating COM Express modules and a new, efficient, stacking I/O connector into a standardized shape, EMX offers advantages to both vendors and customers for new small form factor designs.
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Making it Easier to Make the Right Decisions
Every designer in the process of bringing a product or solution to market is constantly faced with tradeoffs. Deploy quickly or augment the features? Lower the cost or enhance the functionality? These
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High-Performance Graphics Drive Infotainment Design
Small form factor COMs have proven to be broadly applicable to the diverse range of digital signage deployments and application needs characterized by the infotainment arena.
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USB Aims for Truly Universal
USB is making leaps and bounds to make it a truly universal connector. The mentality of not only advancing current technology, but branching out and re-using IP in new areas has rightly made USB a leader in the industry.
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Consolidating Packet Forwarding Services with Data-Plane Development Software
Consolidating all three planes to a single ATCA blade is now possible.
(more)
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GENIVI Alliance opens (car) door even further with new Compliance 2.0 spec
Linux-based and fully open, Compliance 2.0 products interoperate and provide "mandatory" system functions in automotive IVI. The Europe-based non-profit GENIVI Alliance exists to create and nurture the...
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Going Native with SuperSpeed
Why access to native 10b data is essential to troubleshooting USB 3.0 designs.
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From Guts to GUI
The consumerization of digital signage applications is driving opportunity from the inside out.
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Selection Criteria for High-Endurance Industrial Storage Solutions
Until recently, high entry-level prices often discouraged the use of industrial SSDs, but thanks to ongoing price optimization they are now becoming more popular as storage media.
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Intel® Atom™ Energizes PC/104
Thirteen PC/104 Consortium members have combined to introduce over twenty-five Intel® Atom™ processor-based products, with more on the way.
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Standards Vie for Mobile Medical Leadership
Qseven modules running Windows or Linux applications on Intel Atom processors provide a proven and accessible path to market for mobile medical devices.
Embedded computer manufacturers are placing their
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Body Area Networking Heats Up in Medical Field
Standards battle brews for wireless chips
For years, chip makers have been waiting for huge growth in the medical market.
So far, though, the medical semiconductor market has yet to see a major boom,
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Facebook Wants New and Cheaper Memories
For years, Intel Corp., and to a lesser extent, the systems and memory houses, dictated the roadmaps in the processor, DRAM and other segments
Traditionally, Intel rolls out a new microprocessor and an
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Network Evolution Challenges
As Ethernet gears up to 10, 40 and 100 Gigabits per second, developers better pull on their running shoes to keep up.
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Internet Minute Drives Packet Acceleration
Intel’s latest two-chip Crystal Forest platform adds data packet acceleration to existing telecommunication application and control plane functionality.
Staying true to its telecommunication workload
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| WinSystems |
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Fanless, low power SBC with Intel® ATOM™ 1.66GHz
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WinSystems' EPX-C380 is an embedded EPIC PC that provides an open platform for industrial applications. Powered with a single or dual core processor, it has a wealth of onboard I/O; plus can be expanded with PC/104-Plus and miniPCIe modules. This SBC will operate from -40° to +85°C without a fan.
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FROM THE BLOGOSPHERE |
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PRODUCT SHOWCASE |
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EECatalog provides in-depth coverage of the industry's most important platforms, technologies and applications.
Sign up today for your FREE subscription to EECatalog Engineers' Guides and email newletters – including full online access to www.eecatalog.com.
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| UPCOMING EVENTS |
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RTECC - Real-Time & Embedded Computing Conference
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7/31/2012 - Denver, CO
8/2/2012 - Salt Lake City, UT
8/21/2012 - Irvine, CA
8/23/2012 - San Diego, CA
9/11/2012 - Detroit, MI |
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AdvancedTCA & MicroTCA Summit 2012
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Santa Clara Marriott Hotel
2700 Mission College Blvd, Santa Clara, California USA |
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September 18-19, 2012 |
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2012 Embedded Systems Conference - Boston
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Boston, MA |
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September 17-20 |
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4G World 2012
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Chicago, IL |
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October 29-November 1 |
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more events |
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Interested in showcasing your hardware, software or services
in these issues?
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Contact Clair Bright, Publisher @
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cbright@extensionmedia.com
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